技术支持
INTRODUCTION TO PACKAGING
封装介绍
| 缩略语 | 全称 |
| PFM | Plastic Flange Mount Package |
| PDIP | Plastic Dual-In-Line Package |
| LQFP | Low Profile Quad Flat Pack |
| LGA | Land Grid Array |
| LCCC | Leadless Ceramic Chip Carrier |
| JLCC | J-Leaded Ceramic or Metal Chip Carrier |
| JEDEC | The JEDEC Standard for this package type |
| HVQFP | Thermally Enhanced Very Thin Quad Flat Package |
| HTSSOP | Thermally Enhanced Thin Shrink Small-Outline Package |
| HTQFP | Thermally Enhanced Thin Quad Flat Pack |
| HSOP | Thermally Enhanced Small-Outline Package |
| HQFP | Thermally Enhanced Quad Flat Package |
| HLQFP | Thermally Enhanced Low Profile QFP |
| FC/CSP | Flip Chip/Chip Seale Package |
| DFP | Dual Flat Package |
| Description | Description of package type |
| CZIP | Ceramic Zig-Zag Package |
| CFP | Ceramic Pin Grid Array |
| CDIP SB | GSide-Braze Ceramic Dual In-Line Package |
| CDIP | Glass-Sealed Ceramic Dual In-Line Package |
| CBGA | BCeramic Ball Grid Array |
